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TE Connectivity
Reflowable Thermal Protection for
Power Electronics Designs in Rugged Environments
Typical Resistance (R PP ) Vs Temperature
Typical Resistance (R (Passive Testing)
) Vs Temperature
(Passive Testing)
TYPICAL ELECTRICAL PERFORMANCE CHARACTERISTICS
Typical Resistance (R PP ) Vs Temperature
(Passive Testing)
PP
1.0 RTP200R060SA
Typical Resistance (R PP ) Vs Temperature
Typical Resistance (R PP ) Vs Temperature
(Passive Testing) Testing)
(Passive
1.0
1.0
RTP200R060SA
RTP200R060SA
1.0
0.5
0.5
RTP200R060SA RTP200R060SA
0.5
0.5
0.5
0.0
Temperature (°C)
0.0
0.0
0
50
100
0
150
50
200
100
150
200
0
50
150
100 Temperature (°C)
200
Temperature (°C)
(in mm) single layer FR4 boards with 2mOhm, 70 μ m (2oz) Cu traces, and a 645mm 2 ,
Note: Results were obtained on 44.5 x 57.2 x 1.6 Typical Operating Current Vs Temperature
Typical Time-to-Open Vs Fault Current (I PP Open)
70 μ m Typical Operating Current Vs Temperature pad as of described device. (See RTP device test board drawing)
Typical Time-to-Open Vs RTP200R060SA (I PP Open) (Mounted as descri
Fault Current
for
Device
Typical Operating Current on user ’s in configuration and should be validated by the user in for RTP200R060SA Device above notice)
the end system. described in
Results (Mounted based described Temperature notice) 100
Typical Time-to-Open Time-to-Open Current Current (I PP Open)
-55°C
RTP200R060SA
for RTP200R060SA Device
for RTP200R060SA Device
Typical Operating Operating Temperature Temperature
23°C
10 (Mounted (Mounted as described notice)
as described in above in above 23°C
+175°C
100
10
-55°C
RTP200R060SA
RTP200R060SA
0.0
40
30
40
0
0.0
200 100 150 200 150
0 50 50 100 INSTALLATION DEPENDENT PERFORMANCE CHARACTERISTICS
the P TH
(2oz) Cu heat spreader connected to (Mounted the RTP in above notice)
100 (Mounted
40 (Mounted as described in above notice) RTP200R060SA as described in above notice)
100
as (Mounted as in above above
30 (Mounted described described notice) notice) notice)
40 100
(Mounted as
(°C)
Temperature Temperature (°C) Typical Time-to-Open Vs
for RTP200R
RTP200R060SA 10 -55°C
20 1 +175°C -55°C
20
30
20
30
10
10 1
1
10
0.1
23°C
+175°C
23°C
+175°C
10
20
10
20
0
0.1 1
0.1
1
0.01
Temperature 0.1 (°C)
0.01
Fault Cu
10
0
10
0
50
100
0
150
50
200
100
150
0.1 0
50
200
0
100 150 200
50
250
100 15
300
0
50
150
100 Temperature (°C)
200
0
50
100
200
150 Fault Current (A) 250
300
Temperature (°C)
Fault Current (A)
0
0
0.01
0.01
0
0
50
50
100
100
150
150 200
200
0
50
50
100
150
100
150
200
250
200
250
300
300
(°C)
Temperature Temperature (°C)
(A)
Fault Current Fault Current (A)
Typical Arming Time @ 23 +/-3°C
Test Board: 44.5 x 57.2 x 1.6 mm, 70 μ m 4x .100 3X ?.030 .039 (1.00)
(2oz) Cu
Typical Arming Time @ 23 +/-3°C
Typical Arming Time described in 1 above notice)
@ 23 +/-3°C
4x .100 4x .100 3X ?.030 ± AFTER PLATING
(Mounted as
PLATED THRU HOLE
AFTER PLATING
.039 (1.00)
1 (Mounted as described in above notice)
4x .100
4x .100
(Mounted as described in above notice) ± .003
.039 (1.00)
4x .100
RTP200R060SA PLATED THRU HOLE
Typical Arming Arming +/-3°C 23 RTP200R060SA
RTP200R060SA
.039 (1.00) .039 (1.00)
1
1
0.1
1
0.1
as (Mounted as in above above
(Mounted described described notice) notice)
0.1
RTP200R060SA RTP200R060SA
4x .100
4x .100
1.750
(44.5)
4x .100
4x .100
1.750
(44.5)
3X
3X ?.030 ± .003 ?.030 ± .003
AFTER
AFTER PLATING PLATING
HOLE
PLATED THRU PLATED THRU HOLE
1.750
(44.5)
Activation 4.0
Current - I ARM (A) 5.0
Activation Current - I ARM (A) - I ARM (A)
P 1
P
P 1
P TH
2.250 (57.2)
.039 (1.00)
Activation Current - I ARM (A) .039 (1.00) 4X ?.065 ± .003 ?.065 ± .003
ARM
NON PLATED NON PLATED HOLE
ARM
HOLE
P TH pad area = 661mm 2 , P 1 pad area = 393mm 2 , ARM pad area = 169mm 2
2.250 (57.2) 2.250 (57.2)
0.1
0.01
0.01
2.0
2.0
0.1
0.01
0.01
2.0
2.0
3.0 4.0
3.0
Activation Current - I ARM (A)
3.0 3.0 4.0 4.0 5.0
Activation Current
0.01
2.0
5.0
3.0 4.0 5.0
1.750 1.750
ARM TH NON PLATED HOLE .039 (1.00
2.250 (57.2)
1
P 1 P 2.250 (57.2) P TH P TH
.039 (1.00) .039 (1.00)
4X ARM .003
?.065 ± NON PLATED HOLE
(44.5) (44.5) P 1 4X ?.065 ± .003 P T
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